Dynamic Process Group specializes in resizing and coring wafers of various types, including silicon wafers, up to 450mm in diameter into smaller wafers. We core all standard sized wafers; 25.4mm, 50.8mm, 76.2mm, 100mm, 150mm, 200mm, 300mm, and 450mm. Patterned and blank wafers can be cut to any geometry or size; round, square, notched, flat on the bottom, multiple flats, etc.

We core silicon, germanium, gallium arsenide, indium phosphide, graphite, silicon carbide, diamond coated wafers, stainless steel wafers, and many others. If you need to core or resize your wafers, we have you covered.