About
More AboutDynamic Process Group, Inc.
About
More About Dynamic Process Group, Inc.
Precision wafer processing for the work that can't be repeated.
Dynamic Process Group, Inc. has provided precision wafer processing in Silicon Valley since 2013. We core, resize, dice and laser-machine semiconductor wafers for fabs, research labs, universities, and defense and aerospace programs. The core of our work is a Synova Laser MicroJet, supported by mechanical coring, edge grinding and sample preparation.
Our customers come to us with material they can't easily replace: patterned device wafers, custom-grown III-V and infrared substrates, shuttle runs and thick specialty stock. Every process decision we make is about returning that material to spec, on schedule, with its IP protected.
How we work
- Engineering first. Every job is reviewed and programmed by process engineering, and your questions go straight to the people running your material.
- Confidential by default. We are ITAR registered, all work is performed under NDA, and we operate a restricted-access facility.
- Built for small lots. We take single wafers and engineering quantities, with Standard, Priority and Hot Lot lead times.
- Proven process. Customers have qualified our coring process flow for using laser-cored material in their proprietary bonding processes.
Since 2013 · 25.4mm–450mm · ±150µm standard tolerance · ITAR registered
Precision wafer processing for the work that can't be repeated.
Dynamic Process Group, Inc. has provided precision wafer processing in Silicon Valley since 2013. We core, resize, dice and laser-machine semiconductor wafers for fabs, research labs, universities, and defense and aerospace programs. The core of our work is a Synova Laser MicroJet, supported by mechanical coring, edge grinding and sample preparation.
Our customers come to us with material they can't easily replace: patterned device wafers, custom-grown III-V and infrared substrates, shuttle runs and thick specialty stock. Every process decision we make is about returning that material to spec, on schedule, with its IP protected.
How we work
- Engineering first. Every job is reviewed and programmed by process engineering, and your questions go straight to the people running your material.
- Confidential by default. We are ITAR registered, all work is performed under NDA, and we operate a restricted-access facility.
- Built for small lots. We take single wafers and engineering quantities, with Standard, Priority and Hot Lot lead times.
- Proven process. Customers have qualified our coring process flow for using laser-cored material in their proprietary bonding processes.
Since 2013 · 25.4mm–450mm · ±150µm standard tolerance · ITAR registered
Precision wafer processing for the work that can't be repeated.
Dynamic Process Group, Inc. has provided precision wafer processing in Silicon Valley since 2013. We core, resize, dice and laser-machine semiconductor wafers for fabs, research labs, universities, and defense and aerospace programs. The core of our work is a Synova Laser MicroJet, supported by mechanical coring, edge grinding and sample preparation.
Our customers come to us with material they can't easily replace: patterned device wafers, custom-grown III-V and infrared substrates, shuttle runs and thick specialty stock. Every process decision we make is about returning that material to spec, on schedule, with its IP protected.
How we work
- Engineering first. Every job is reviewed and programmed by process engineering, and your questions go straight to the people running your material.
- Confidential by default. We are ITAR registered, all work is performed under NDA, and we operate a restricted-access facility.
- Built for small lots. We take single wafers and engineering quantities, with Standard, Priority and Hot Lot lead times.
- Proven process. Customers have qualified our coring process flow for using laser-cored material in their proprietary bonding processes.
Since 2013 · 25.4mm–450mm · ±150µm standard tolerance · ITAR registered
A restricted-access facility, by design.
Every job we run is covered by a client NDA. At any given time our floor holds proprietary wafers, shuttle-run material, and unreleased device IP from multiple customers. To protect all of them, we don't host site visits or tours.
The same policy that keeps your competitors off our floor is what lets you trust us with your most sensitive work.