CLEANROOM FABRICATION

Laser Micromachining

DPG stocks wafer inventory and fabricates laser micromachining in-house — squares, rectangles, and application-specific shapes from wafers up to 450mm. We also offer precision laser dicing, including bonded materials and 3D-structured substrates, using the Synova Laser Microjet.

Not just a service shop. DPG maintains in-house silicon wafer inventory and processes all work in our own cleanrooms using our own equipment — no outsourcing, no queue at a third-party lab. Laser micromachining and dicing jobs ship faster with full lot traceability.

Laser Micromachining

When standard wafer sizes and shapes don't fit your process, DPG cuts to your specification. We supply custom non-standard silicon wafer geometries — squares, rectangles, rounds, and application-specific shapes — from wafers up to 450mm (18"). Low MOQ, single pieces accepted.

Common Laser Micromachining Applications

Equipment Manufacturers

  • 310mm square substrates from 450mm wafers
  • Equipment qualification coupons
  • Next-gen process tool development
  • Non-standard diameter rounds (25.4mm–450mm)

R&D & Production

  • Rectangular test pieces to spec
  • Application-specific shapes from CAD file
  • Diced arrays and multi-die layouts
  • University and research prototypes

Why DPG for Laser Micromachining

  • In-house silicon wafer inventory — no material lead time
  • Laser-based cutting — clean, chip-free edges
  • Cleanroom processing and packaging
  • Low MOQ — single pieces accepted
  • 5–10 business day turnaround(rush available)
  • 100% dimensional inspection
  • Full lot traceability

Laser Dicing

DPG offers precision laser dicing using the Synova Laser Microjet — a water-guided laser system that eliminates heat-affected zones, blade loading, and edge chipping. Ideal for substrates where conventional blade dicing causes damage or is physically impractical.

Synova Advantage: No Dicing Flange Interference

Conventional dicing saws require the blade and its mounting flange to navigate over and around substrate features. The Synova's laser beam travels through a micro water jet with a working length of approximately 40mm — it reaches material without the flange ever contacting or navigating around 3D structures, wire bonds, stacked dies, or raised features. This makes the Synova the better solution for complex or delicate substrates where a blade saw physically cannot reach.

Bonded Materials & 3D Structured Substrates

The Synova Laser Microjet is uniquely capable of dicing bonded material stacks and substrates with 3D topography. The water-guided laser cuts through heterogeneous material interfaces cleanly — without delamination, thermal cracking, or the mechanical stress of a spinning blade.

Thick Semiconductor & III-V Dicing — 1mm to 5mm

We specialize in Synova laser dicing of thick semiconductor and III-V materials from 1mm to 5mm — GaAs, InP, InAs, InSb, GaSb, and thick silicon and germanium — where a dicing blade loads, wanders, and chips. The water-guided beam cuts straight through the full thickness with a 200–300µm kerf and no heat-affected zone. Thicker than 5mm is possible: if you have the material, we will run a feasibility cut and report the results before you commit to a lot.

Laser Dicing Capabilities

  • Bonded wafer stacks
  • 3D-structured substrates
  • Thin wafers (<100μm)
  • Thick substrates (1mm–5mm)
  • MEMS and sensor dice
  • Compound semiconductor dies
  • Custom street widths

Dicing Advantages

  • Near-zero chipping
  • No heat-affected zone
  • ~40mm laser working length
  • No blade loading or wear
  • Cleanroom processing
  • Single-piece to full-lot runs

Materials Processed

  • Silicon (Si) — 25.4mm (1") to 450mm (18"), in-house inventory stocked
  • Gallium Arsenide (GaAs)
  • Indium Phosphide (InP)
  • Gallium Nitride on Silicon (GaN-on-Si)
  • Germanium (Ge)
  • Silicon-on-Insulator (SOI)
  • Sapphire, glass, fused silica, quartz and SiC — transparent at 1064nm, so these are cored mechanically on our CNC Coring service rather than by laser
  • Bonded material stacks — customer-supplied

Customer-supplied materials accepted. Contact us for materials not listed.

Ready to Discuss Your Application?

Tell us your geometry, material, and quantity. We'll confirm feasibility and quote within one business day.

Request a Quote →

University or research lab? Ask about academic pricing.