Laser Marking Services

Keyence MD-X2020A • 3-Axis Hybrid Laser Marker • Wide Area Capability

Dynamic Process Group provides precision laser marking services using the Keyence MD-X2020A 3-Axis Hybrid Laser Marker. Our system delivers high-contrast, permanent marks on silicon wafers, metals, ceramics, and semiconductor substrates — including alphanumeric IDs, barcodes, 2D Data Matrix codes, and custom logos — with micron-level precision.

Capabilities & Marking Types
Alphanumeric & Text KEYENCE original fonts, TrueType, OpenType; characters 0.1–330 mm
2D Data Matrix & QR Codes ECC200, GS1 DataMatrix, QR, Micro QR — ideal for traceability
1D Barcodes CODE39, CODE128, ITF, NW7, JAN, EAN, UPC-A, UPC-E, CODE93
Logo & Custom Graphics BMP, JPEG, PNG, TIFF image import; CAD data supported
GS1 DataBar Full GS1 DataBar family including stacked, limited, and truncated variants
Moving & Stationary Parts Supports constant-speed and encoder-synchronized moving marking
Equipment Specifications — Keyence MD-X2020A
Parameter Specification
Laser Type YVO4 laser (Nd:YVO4), Class 4 — IEC/EN 60825-1
Wavelength 1064 nm (near-infrared)
Output Power 13 W
Marking Method XYZ 3-axis simultaneous scanning
Marking Area 330 × 330 × 42 mm (12.99" × 12.99" × 1.65")
Standard Working Distance 300 mm ± 21 mm (11.81" ± 0.83")
Marking Resolution 5 μm
Suitable Materials
Material Applications
Silicon Wafers Wafer ID, lot traceability, process tracking
Metals (SS, Al, Ti) Part serialization, compliance marking
Ceramics & Glass Substrate identification, research labeling
Coated Surfaces Anodized aluminum, plated parts
Plastics Resin ID, label-free permanent marking

Ready to mark your parts? Request a quote or sample marking from our team.

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