Precision Wafer Coring Service for High-Value Semiconductor Wafers
Dynamic Process Group specializes in the precision coring and resizing of high-value semiconductor wafers for R&D teams, fab engineers, and process development groups around the world. Using Synova Laser Microjet technology — a water-guided laser process that delivers cleaner cuts and less subsurface damage than conventional mechanical coring — we resize wafers from 2" to 12" (50mm to 300mm) across a wide range of materials with tolerances your process demands.
What Is Wafer Coring?
Wafer coring — also called wafer resizing or wafer downsizing — is the process of reducing a semiconductor wafer's diameter to fit a smaller size specification. A 200mm wafer, for example, can be cored down to 100mm, 150mm, or any custom dimension. The original notch or flat orientation is preserved in the resized wafer, maintaining crystal axis reference for downstream processing.
Coring is distinct from dicing: where dicing singulates a wafer into dies, coring produces a new, smaller-diameter wafer ready for further fab processing. Edge beveling is typically performed after coring to restore mechanical stability and reduce chipping risk.
Why Engineers Need Wafer Coring
As wafer sizes scale up across the industry, older process tools — diffusion furnaces, CVD systems, inspection tools, and handlers — are designed for smaller formats. Replacing that equipment can cost millions. Resizing incoming wafers to match your existing toolset is a fraction of that cost and keeps your process line running without capital expenditure.
- Legacy tool compatibility — Resize 200mm or 300mm wafers to run on 100mm or 150mm toolsets
- R&D and process development — Core expensive compound semiconductor wafers (GaAs, InP, SiC) into multiple smaller wafers to maximize yield from limited material
- Patterned wafer salvage — Recover and reprocess high-value patterned wafers that cannot be restarted at full size
- Custom geometry — Non-circular shapes, offset cores, multi-flat configurations for specialty applications
Our Technology: Synova Laser Microjet
Most wafer coring providers use mechanical core drills — a contact process that generates stress, micro-cracks, and edge chipping, particularly in brittle compound semiconductors.
Dynamic Process Group uses the Synova Laser Microjet, a water-guided laser system that combines laser precision with the cooling and debris-clearing properties of a water jet. The result:
- No heat-affected zone (HAZ) — the water jet cools the cut in real time, preventing thermal damage to surrounding material
- Minimal kerf loss — preserve more of your high-value wafer material
- Cleaner edges — reduced micro-cracking and subsurface damage vs. mechanical drilling
- Versatile across materials — processes hard, brittle, and thermally sensitive materials that mechanical methods struggle with
- Compatible with patterned wafers — safe for wafers with active devices or structures on the surface
Materials We Core and Resize
We process virtually all semiconductor and hard substrate materials:
| Material | Notes |
|---|---|
| Silicon (Si) | All doping types, SOI, bonded stacks |
| Gallium Arsenide (GaAs) | Including patterned and epitaxial |
| Indium Phosphide (InP) | Fragile — laser method reduces breakage |
| Silicon Carbide (SiC) | 4H and 6H polytypes |
| Germanium (Ge) | |
| Gallium Nitride on Silicon (GaN-on-Si) | |
| Sapphire | |
| Quartz / Fused Silica | |
| Glass | Borosilicate, Pyrex, custom |
| Diamond-Coated Wafers | |
| Ceramic Materials | Alumina, AlN |
| Stainless Steel Wafers | |
| Multi-material bonded stacks | Silicon bonded to glass, Si-SiC, and others |
Don't see your material? Contact us — if it's hard and brittle, we can likely process it.
Wafer Sizes and Specifications
Input wafer sizes: 2" (50mm) through 12" (300mm)
Output sizes: Any standard or custom diameter down to 1" (25mm)
Shapes: Circular, square, rectangular, with primary flat, secondary flat, notch, or offset core
Wafer types: Blank, patterned, thinned, bonded stacks
Thickness range: Standard through ultra-thin (fragile wafer handling available)
Flat and notch orientation is maintained and matched to the original wafer's crystal reference. Custom offset coring — where the core center is shifted from the wafer center — is available for specialty applications.
Our Process
- Quote and review — Submit your specs. We review and provide a quote, typically within 24 hours.
- Protective coating — A photoresist or protective film is applied to the wafer surface.
- Thickness verification — Incoming wafers are measured to confirm they meet spec.
- Custom program setup — Cut parameters are programmed to your exact specifications.
- Laser coring — The Synova Laser Microjet system cuts to the programmed geometry.
- Edge beveling — Cut edges are beveled to restore mechanical stability.
- Quality inspection — Each wafer is inspected for dimensional accuracy and edge quality.
- Cleaning — Protective coating is stripped and wafers are cleaned to customer spec.
- Packaging and shipment — Wafers are packaged and shipped per your requirements.
Quality and Tolerances
- Diameter tolerance: ±0.1mm standard; tighter tolerances available on request
- Edge bevel: Matched to SEMI standard or custom specification
- Flat/notch orientation: Maintained to within ±1° of original wafer reference
- Surface cleanliness: DI water rinse standard; cleanroom-compatible packaging available
- Inspection: 100% dimensional inspection on all orders
Dynamic Process Group is ITAR registered, making us a qualified partner for defense, aerospace, and government-funded R&D programs.
Industries Served
- Semiconductor R&D and process development
- III-V compound semiconductor manufacturing
- MEMS and sensors
- Defense and aerospace (ITAR registered)
- University and national laboratory research
- Photonics and optoelectronics
- Power electronics (SiC, GaN)
Frequently Asked Questions
- Can you core patterned wafers?
- Yes. The Synova Laser Microjet process is safe for patterned and processed wafers. The water-guided laser minimizes thermal and mechanical stress to structures on the wafer surface.
- What's the smallest wafer size you can produce?
- We can produce wafers as small as 1" (25mm) in diameter, depending on starting material thickness.
- How many wafers can I get from one 200mm input wafer?
- A single 200mm wafer can yield approximately four 75mm (3") wafers or two 100mm (4") wafers, depending on geometry and offset requirements.
- What is your typical turnaround time?
- Standard turnaround is 5–10 business days from receipt of material. Expedited processing is available.
- Do you offer NDA / confidential processing?
- Yes. We are happy to sign an NDA prior to receiving material.
- Do you handle the full volume from prototype to production?
- We serve both R&D (single wafers, small lots) and higher-volume production runs.
- Can you core wafers that have already been thinned?
- Yes, with care. Ultra-thin wafers require specialized handling. Contact us with your thickness and we will advise on feasibility.
Get a Quote
Ready to discuss your wafer coring project? Contact our team with your material, input size, target output size, quantity, and any special requirements. We typically respond within one business day.
Email: info@waferfab.net | Location: San Jose, CA 95110 (ITAR Registered)