Can you core a 300mm wafer to 150mm?

Yes. 300mm wafers can be cored to 200mm, 150mm, 100mm or any custom diameter down to 25.4mm.

Does the original notch survive coring?

No. The notch sits in the outer ring that coring removes. We add a new SEMI notch or primary flat on request, referenced to the original notch so crystal orientation carries through.

Can you resize patterned CMOS wafers without damaging devices?

Yes. The device side is protected through the cut, then stripped and cleaned. The Laser MicroJet does not touch the wafer surface, and the water jet cools the cut as it goes.

Do you return the outer ring?

Always. Every piece of your wafer comes back — the cored wafer and the remnant ring ship together. Nothing with your pattern on it stays at DPG.

Is my material protected?

DPG is ITAR registered and works under NDA as standard practice. We run a restricted-access facility: no tours, and material is received and returned by controlled shipment.

300mm to 200mm Wafer Resizing for Patterned and Blank Wafers

Built it on a 300mm line, but your bonding, metrology or packaging tools run 200mm? We laser-core 300mm silicon, SOI and patterned CMOS wafers down to 200mm, 150mm, 100mm or any custom diameter on a Synova Laser MicroJet — a water-guided laser that cuts without touching the wafer surface.

Engineering lots are standard work here. Send one wafer or fifty; the process and the care are the same.

Request a Quote Call or text (408) 258-5000

Why Engineers Resize 300mm Wafers

Tool mismatch — devices or test structures built at a 300mm foundry, characterized or bonded on 200mm or 150mm tools
MPW and shuttle wafers — bring 300mm shuttle material into a 200mm R&D line
Calibration and reference wafers — put 300mm-built artifacts on 200mm and 150mm metrology tools
Salvage — recover the usable center of a high-value wafer with a damaged or chipped edge

Specifications

Parameter	Capability
Input diameter	300mm (450mm on request)
Output diameter	200mm, 150mm, 100mm or custom
Diameter tolerance	±150µm standard; tighter on request
Thickness	200µm–5mm; wafers keep their incoming thickness
Kerf	200µm ±25µm
Orientation	New SEMI notch or primary flat on request, referenced to the incoming notch
Core position	Concentric by default; off-center cores from a specific region using our alignment and vision system
Surface protection	Device side protected through coring, then stripped and cleaned
Edge	As-cored; rounding available — see Edge Grinding
Remnants	Always returned with the cored wafers
Quantity	From a single wafer
Lead time	Standard ~2 weeks · Priority ~1 week · Hot Lot 48 hours

The Thickness Question

A cored 300mm wafer keeps its ~775µm thickness. A native 200mm wafer is 725µm. Most 200mm tools accept the difference, but edge-grip end effectors, thickness-sensing prealigners and some cassettes may not. Tell us which tools the wafers are going to, and we'll flag any concern before we quote.

Orientation and Traceability

Coring removes the original notch and the outer edge, which is usually where the laser scribe ID sits. We can add a new notch or flat aligned to the original crystal orientation, and laser-mark a new ID on the resized wafer so parent-to-child traceability survives the resize.

What to Send for a Quote

Material and stack (bulk Si, SOI, films on top)
Incoming diameter and thickness
Target diameter and tolerance
Notch or flat requirement
Patterned or blank, and any keep-out zones
Quantity and need-by date

Frequently Asked Questions

Can you core a 300mm wafer to 150mm?: Yes. 300mm wafers can be cored to 200mm, 150mm, 100mm or any custom diameter down to 25.4mm.
Does the original notch survive coring?: No. The notch sits in the outer ring that coring removes. We add a new SEMI notch or primary flat on request, referenced to the original notch so crystal orientation carries through.
Can you resize patterned CMOS wafers without damaging devices?: Yes. The device side is protected through the cut, then stripped and cleaned. The Laser MicroJet does not touch the wafer surface, and the water jet cools the cut as it goes.
Do you return the outer ring?: Always. Every piece of your wafer comes back — the cored wafer and the remnant ring ship together. Nothing with your pattern on it stays at DPG.
Is my material protected?: DPG is ITAR registered and works under NDA as standard practice. We run a restricted-access facility: no tours, and material is received and returned by controlled shipment.

Start a Quote

Send the incoming spec, target diameter and quantity. We quote within one business day.