Precision sectioning and polishing for inspection-ready samples.
We now offer sample preparation on a Buehler IsoMet® 1000 precision sectioning saw. Low-speed, low-load sectioning, followed by mounting and polishing, gives you clean cross-sections of wafers, die, packages and materials, prepared for failure analysis, metallography and interface inspection.
- Low-deformation sectioning
- Epoxy mounting & polishing
- In-house optical inspection
- Work performed under NDA
Sample prep for engineers who need to see inside
A bad cut smears layers, cracks brittle films and hides the defect you are looking for. Our process is built to keep the structure of the sample intact from the first cut to the final polish.
Precision sectioning
Gravity-fed, low-speed diamond-blade cutting minimizes stress and subsurface damage in brittle and layered materials.
Cross-sections of wafers, die & packages
Section through a specific die, bond line, via or package location to expose the structure you need to inspect.
Mounting, grinding & polishing
Samples are mounted in epoxy, then ground and polished to the finish your inspection method requires, managed under the same NDA and lead time.
Bond-line & interface inspection
Prepare cross-sections of bonded wafers, stacks and coatings to evaluate interfaces, voids and layer thickness.
Optical inspection
Prepared sections can be imaged in-house on our Keyence digital microscope before they ship back to you.
Laser + saw workflow
Extract a region with our Synova Laser MicroJet, then section it on the IsoMet, all under one roof and one NDA.
Laser coring →Buehler IsoMet® 1000 precision sectioning saw
| Cut action | Gravity-fed, counterbalanced sliding load weight system |
|---|---|
| Blade diameter | 3″ to 7″ (76mm to 178mm); standard blade 6″ × 0.020″ on a ½″ arbor |
| Blade speed | Variable, up to 975 rpm |
| Applied load | 0 to 500g standard; 0 to 800g with weight kit |
| Cutting capacity | Up to 2″ (50mm) diameter |
| Sample positioning | Digital micrometer, inch or millimeter |
| Drive | 1/8 HP (90W) DC motor, variable arbor speed |
| Cut completion | Automatic cut-off switch at end of cut |
| Coolant | Removable coolant tray with built-in blade dressing device |
| Cutting chamber | Fully enclosed |
Specifications are the manufacturer’s published values for the IsoMet 1000.
Semiconductors and beyond
Semiconductors
Si, SOI, GaAs, InP, Ge, SiC, GaN-on-Si
Glass & crystals
Sapphire, fused silica, quartz, glass
Devices & assemblies
Die, bonded wafers, packages, electronic components
Ceramics & composites
Technical ceramics, composites, coatings
Metals
Ferrous and non-ferrous metals, alloys
Minerals
Rocks, minerals and other brittle samples
Where sample prep fits
- Failure analysis: expose cracks, delamination and voids at the failure site
- Bonding qualification: inspect bond lines and interfaces in bonded stacks
- Film and coating thickness: measure layers in cross-section
- Process development: check etch profiles, vias and structures
- Materials research: prepare samples for metallography and microscopy
Lead-time tiers
What to send us
- Sample: material or device type, and overall size
- Section location: where to cut and which plane to expose, with a sketch or image if possible
- Finish: as-cut, mounted, or the polish level your inspection needs
- Imaging: whether you want optical images of the prepared section
- Quantity
- Your deadline: Standard or Priority
Send us the sample you need to see inside.
Tell us what you are looking for and where. We'll section and polish it to match.
Call or text: (408) 258-5000