Can you core 4-inch InP down to 3-inch with SEMI flats?

Yes. We cut the new diameter and the primary and secondary flats in the same setup, aligned to the incoming flats or to your drawing.

Will coring damage the epitaxial layers?

The epi is protected through the cut, and the laser only removes material in the 200µm kerf. The rest of the surface is not touched.

What is the minimum order?

One wafer. Most III-V jobs we see are two to five wafers.

Can you get several smaller wafers out of one larger wafer?

Often, yes. Send the incoming diameter and the target size and we'll lay out how many fit once kerf and edge exclusion are accounted for.

How is InP and GaAs waste handled?

Cutting debris from III-V materials is captured and disposed of as hazardous waste, and wafers are cleaned before they are returned.

InP and GaAs Wafer Coring and Resizing

III-V wafers are expensive, brittle and often carry epi you can't replace. A mechanical core drill puts all of that at risk. We core InP, GaAs and related III-V wafers with a Synova Laser MicroJet — a water-guided laser that cuts without mechanical contact, so there is no drill load on a fragile substrate.

Typical jobs are small: two to five epi wafers resized for a tool that only takes 3-inch or 2-inch. That is exactly the work we're set up for.

Request a Quote Call or text (408) 258-5000

Typical III-V Jobs

100mm to 76.2mm (4-inch to 3-inch) InP with primary and secondary flats
76.2mm to 50.8mm (3-inch to 2-inch) for legacy MBE, MOCVD and lithography tools
150mm GaAs to 100mm or custom diameters
Epitaxial wafers cored as-received — no thinning, no touching the epi outside the cut
Several small wafers from one large wafer when material is scarce
Thick bulk GaAs — through-cuts up to 5mm thick, suitable for parts going on to downstream bonding

Materials

InP, GaAs, AlGaAs, InAs, InSb, GaSb, CdTe/CdZnTe and HgCdTe — any material that absorbs at our 1064nm wavelength. Sapphire, glass and other transparent substrates go through CNC coring instead.

Specifications

Parameter	Capability
Diameter range	25.4mm–450mm input; any smaller target
Diameter tolerance	±150µm standard; tighter on request
Thickness	200µm–5mm
Kerf	200µm ±25µm
Flats	Primary and secondary flats to your drawing or the standard you specify
Surface protection	Epi side protected through coring, then stripped and cleaned
Debris handling	III-V cutting debris is captured and handled as hazardous waste
Remnants	Always returned with the cored wafers
Quantity	From a single wafer
Lead time	Standard ~2 weeks · Priority ~1 week · Hot Lot 48 hours

Why Laser Instead of a Core Drill

InP in particular cleaves easily and chips at the slightest point load. A core drill loads the wafer the whole way around the cut. The Laser MicroJet guides the beam inside a water jet about 150µm across, which cools the cut and carries debris away as it goes. The result is less chipping and less subsurface damage on the material that can least afford it.

What to Send for a Quote

Material, and whether the wafer carries epi or patterns
Incoming diameter and thickness
Target diameter and flat requirements (primary, secondary, orientation)
Quantity and need-by date

Frequently Asked Questions

Can you core 4-inch InP down to 3-inch with SEMI flats?: Yes. We cut the new diameter and the primary and secondary flats in the same setup, aligned to the incoming flats or to your drawing.
Will coring damage the epitaxial layers?: The epi is protected through the cut, and the laser only removes material in the 200µm kerf. The rest of the surface is not touched.
What is the minimum order?: One wafer. Most III-V jobs we see are two to five wafers.
Can you get several smaller wafers out of one larger wafer?: Often, yes. Send the incoming diameter and the target size and we'll lay out how many fit once kerf and edge exclusion are accounted for.
How is InP and GaAs waste handled?: Cutting debris from III-V materials is captured and disposed of as hazardous waste, and wafers are cleaned before they are returned.

Start a Quote

Send the material, incoming and target diameter, flat requirements and quantity. We quote within one business day.