SOI Wafer Coring and Resizing

Most SOI is made on 200mm and 300mm. Most photonics, MEMS and RF development lines run 150mm or 100mm. We close that gap. DPG laser-cores blank and patterned SOI — including raw Soitec SOI — into the diameter your line runs, with the device layer, BOX and handle kept intact.

Have your SOI supplier drop-ship straight to our lab. We core, clean and forward the wafers, so they arrive at your fab ready to load.

What We Do With SOI

  • 300mm or 200mm to 150mm, 100mm or custom — blank or patterned
  • Patterned SOI — device side protected through coring, then stripped and cleaned
  • New flats and notches — for example a SEMI primary flat centered on the incoming notch bisector
  • Drop-ship programs — wafers go from the SOI supplier to DPG to your fab
  • Remnants always returned — every piece of your wafer ships back with the cored wafers

Specifications

Parameter Capability
Input diameter Up to 300mm (450mm on request)
Output diameter 150mm, 100mm or custom
Diameter tolerance ±150µm standard; tighter on request
Stack Device layer, BOX and handle cut together; handle thickness as supplied
Kerf 200µm ±25µm
Orientation Primary flat or notch on request, referenced to the incoming notch
Edge As-cored; rounding available — see Edge Grinding
Remnants Always returned with the cored wafers
Quantity From a single wafer
Lead time Standard ~2 weeks · Priority ~1 week · Hot Lot 48 hours

Need SOI Wafers Too?

We also supply SOI in custom diameters, thicknesses and orientations for R&D and pilot lines. See SOI Wafers.

What to Send for a Quote

  • Device layer, BOX and handle thickness
  • Incoming diameter, and blank or patterned
  • Target diameter and flat or notch requirement
  • Whether the wafers will ship to us from your supplier
  • Quantity and need-by date

Frequently Asked Questions

Can my SOI supplier ship directly to you?
Yes. Customers routinely have SOI orders drop-shipped to our lab. We confirm arrival and quantity, core the wafers and forward them to you.
Can you core patterned SOI without damaging devices?
Yes. The device side is protected through the cut, then stripped and cleaned before return. The laser only removes material in the 200µm kerf.
Can you put a flat where my notch was?
Yes. A common request is a SEMI primary flat centered on the incoming notch bisector, on the same side as the notch.
Do you process Soitec SOI?
Yes. We process raw 200mm and 300mm Soitec SOI into the form factors customers need for their own films and patterns.
What is the minimum quantity?
One wafer. There is no minimum lot size.

Start a Quote

Send the SOI stack, incoming and target diameter, orientation requirement and quantity. We quote within one business day.

Related: Wafer Coring and Resizing · 300mm to 200mm Resizing · SOI Wafers